《毕业设计(论文)-换热器热应力耦合及有限元ANSYS分析》.docVIP

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《毕业设计(论文)-换热器热应力耦合及有限元ANSYS分析》.doc

摘 要 换热器是传热工程必不可少的设备,几乎一切工业领域都要使用。化工,冶金,动力,交递,航空与航天部门应用尤为广泛。在底部有热源作用的散热片,主要通过传导与对流进行热交换。为保证散热片的散热性能达到设计的要求,从而避免电子产品因过热而造成损坏,就需要对其进行热分析,计算在实际工况下的温度分布,校核其散热性能。因此,对换热器进行热应力耦合分析具有十分重要意义。传统方法的热分析其温度变化必须是非常的缓慢,而且在升降温过程中的不易控制,难以正确校核其散热性能。随着计算机技术的发展,使得有限元法有着突飞猛进的进展。结合计算机辅助设计技术,有限元法也被用于计算机辅助制造中。 Heat exchanger?coupled?thermal stress?analysis Abstract Heat transfer engineering is essential equipment to be used almost all industrial fields. Chemical, metallurgical, power, handoff, application of aviation and aerospace sector is particularly extensive. In the bottom of the heat sink effect, mainly through conduction and convection heat exchange. To ensure the heat sink thermal performance to meet the design requirements, so as to avoid overheating of electronic products due to damage to its thermal analysis requiredto calculate the temperature distribution in the actual conditions, check the heat dissipation. Therefore, thermal stress coupled heat exchanger analysis is of great significance. Traditional methods of thermal analysis the temperature change must be very slow, and in heating and cooling process difficult to control, difficult to properly check its thermal performance. With the development of computer technology, finite element method has made rapidprogress. Combined with computer-aided design,finite element method is also used in computer-aided manufacturing. ANSYS thermal analysis is based on the principle of conservation of heat energybalance equation, the correct simulation of the heat sink conditions, the finite elementmethod to calculate the temperature distribution of each node, and thus other thermalphysical parameters derived for the design of heat sink to provide a reasonableselection of parameters Make product development more rapid, efficient and economical. Key Words:Heat?control;Finite element;ANSYS;Heatsink 目 录 摘 要 I Abstract II 第一章 绪论………………………. 1 1.1 引言 1 1.2 计算机仿真技术的发展 1 1.3 热分析方法的选择 2 第二章 课题相关知识介绍 4 2.1散热片知识 4 2.1.1散热片的材质比较 4 2.1.2散热片结构的设计 4

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