无铅培训资料4.ppt

* TP Products Engineering Grp. * TP Production Team 1 Progress of Pb-Free MP Start-up 无铅化量产开始后进展 Content 内容 1. Quality Condition （品质状况） 2. Remodeling/ Change of Facility （设备改造/变更） 3. Printing Process （丝印过程） 4. Reflow Process （回流过程） 5. Flow Soldering Process （波峰焊接过程） 6. What Remains to Be Seen （待进一步解决之课题） 2 Quality Condition 品质情况 Quality Comparing with Pb Eutectic 和含铅焊料进行品质对比 MP Quality Condition 量产品质情况 3 Quality Comparing with Pb Eutectic 和含铅焊料进行品质对比 Defective Fraction : Pb-Free Start-up （不良比率：无铅化初始） 0.2% 0.3% QPIT Defective Fraction 0.5% 1.0% ICT Defective Fraction 1.4% 1.0% A-Side Defective Fraction Tendency Pb-Free Pb Eutectic Japan SMT : C304MAIN (Pb Eutectic: 7,000 units, Pb-Free: 6,600 units 3/E -4/F) There is not much change with defective fraction at start-up of Pb-Free. 无铅化初始时不良率无太大变化 4 Quality Condition 品质情况 Transition of Defective Fraction (Start-up - 5/M) 不良率转换 Defective Fraction（%） Japan SMT: C304MAIN 0.21% 54,981 QPIT 0.31% 54,981 ICT 0.65% 61,613 A-Side Average Defective Fraction Inspection Quantity 5 Remodeling/ Change of Facility设备改造/变更 Facility Remodeling 设备改造 Solder Iron for Pb-Free 无铅化焊锡用烙铁 6 Remodeling/ Change of Facility 设备改造/变更 Countermeasures for Parts with Low Heat Resistance 低耐热部品对策 Solder Iron 焊锡烙铁 Change of Setting Condition 设定条件变化 Repair Center 修正中心 Quality Securing 品质安全 Keeping of Preheat Quantity 保持预热数 Improvement of Solder Melting Ability 改进焊锡溶融能力 Improvement of Temp. Control Accuracy改善温度控制精度 Time Saving of Solder Melting 减少焊锡溶解时间 Prevention for Solder Bumping 防止焊锡喷锡 Folw Solder Bath 锡槽 Reflow Furnace 回流炉 No Change (无变化) Adhesive Coating Machine点胶机 Mounter 贴装机 Rolling Ability, Through Ability 滚动能力,穿透能力 Measures for Clogging 堵塞测试 Printing M/C (M/C 丝印） Facility Changed Contents Reason of Change Squeegee: Rubber squeegee is adopted (采用橡胶刮刀) Cleaning: 20 sheets/cleaning 5 sheet/cleaning Change of setting condition: one cycle profile 条件设定变化: 单循环温度曲线 Change of setting condition (设定条件变化) P