Back-sideillumination,wafer-scaleopticsdrive2×-5×jumpinCMOSimagesensorperformance.docxVIP

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Back-sideillumination,wafer-scaleopticsdrive2×-5×jumpinCMOSimagesensorperformance.docx

Back-side illumination, wafer-scale optics drive 2×-5× jump in CMOS image sensor performanceIts not just 3D packaging technology where CMOS image sensors are driving IC technology these days. Ultrathin silicon that enables back-side illumination (BSI), and integrated wafer-level optics are bringing sharply improved performance, lower costs, and smaller size, driving CMOS image sensors into more and more markets—and these technologies may soon impact other IC manufacturing as well.Thinning silicon wafers down to 5μm transparent films to let light through the back side is driving a 2× to 5× improvement in sensitivity for smaller pixel image sensors. Yole Développement sees CMOS sensors now moving quickly into higher performance applications, including high resolution digital SLR cameras and digital video recorders, as they come to match the performance of CCDs at lower cost. These thinning and annealing technologies may also open new possibilities for 3D stacking and integration of very thin layers of memory and logic devices in the future. Wafer-level optics are also starting to reduce camera module size and cost in even demanding handset applications, and could also bring similar improvements to projection lens systems for gaming stations and micro displays.CMOS image sensors drive ultrathin wafer technology roadmapOne of the key breakthroughs that enables these major improvements in performance and price is backside illumination, which requires thinning the silicon wafer down to a transparent 5μm active layer, so the light can come in directly to the photo diode from the backside. Putting the electrical distribution layers behind the photo diode allows a simpler and more flexible BEOL architecture design, eliminating the need to leave openings in the pattern to let light through, and naturally lets in much more light, allowing higher resolution or higher sensitivity for the same given sensor size and cost. Next step, now in the development stage, is to take advanta

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