DFG841技术规范.docVIP

DFG841 磨片设备技术规范指标 features 1)For wafer ..φ8 .. It is possible to grind to the wafer of maximum φ8 in consideration of the large caliber of the wafer in recent years. 2)Fine finish of grinding side roughness Ra 0.01μm or less is possible. Past [sa-fe] according to the wheel technology and a high rigidity and the superprecision machine technology of the disco lasting for half a century. Fine finish that exceeds the common sense of [isukurainta] has been achieved. 3)Automatic management making by in-process measurement about grinding thickness The work thickness under grinding is measured, and the corrected complete, closed loop mechanism is adopted. [Sonota] It summons, the wheel is worn out, the influence such as the expansion and contraction of the spindle is not received easily, and a highly accurate finish thickness is managed. It can do. 4)Stiffness enhancement of chuck table, high rigidity, and adoption of low vibration spindle The turntable was abolished, and the chuck table was installed in strong [beddohe]. A new spindle of a high rigidity and the low vibration is adopted for the spindle that has a big influence on the processing of work and good. The grinding result can be obtained it is ..good... 5)Enhancement of safe design and various security functions Assume the worker protection to be the first by interlocking when the cover opens and shuts and adopting the UL recognition product, and, and, [Su] pin dollar air, the grinding water, and ..piling up.. flowing quantity etc. of cooling water are always observed, and the pole of the damage to the device at the emergency. Power is suppressed. The generation of static electricity is suppressed because it equips it with the ionizer as a countermeasure against static electricity. 6)Lightness and space-saving design Lightening was aimed at in consideration of the clean room installation. Moreover, the moved distance of work is made the shortest, and [se]. The miniaturi