[MTK智能机平台设计方案比对.pptVIP

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[MTK智能机平台设计方案比对

MTK 智能平台设计方案比对 MTK 智能机平台示意图 MTK 智能机平台比对- Pattern MTK 智能机平台比对-Pattern MTK 智能机平台比对-Pattern MTK 智能机平台比对- Pattern MTK 智能机平台分析-走线 MTK 智能机平台分析-走线 MTK 智能机平台分析-走线 MTK 智能机平台分析-走线 * * Evaluation only. Created with Aspose.Slides for .NET 3.5 Client Profile 5.2.0.0. Copyright 2004-2011 Aspose Pty Ltd. Evaluation only. Created with Aspose.Slides for .NET 3.5 Client Profile 5.2.0.0. Copyright 2004-2011 Aspose Pty Ltd. A Company design - 8 layers with 1+6+1 Outer layer copper: 0.25mm Solder mask Pad: 0.35mm Buried hole: 0.2mm Buried hole pad: 0.45mm Comment: Much protection copper in CPU BGA and Flash BGA. connected line focused on second layer. Evaluation only. Created with Aspose.Slides for .NET 3.5 Client Profile 5.2.0.0. Copyright 2004-2011 Aspose Pty Ltd. B Company design - 8 layers with 1+6+1 Outer layer copper: 0.25mm Solder mask Pad: 0.325mm Buried hole: 0.25mm Buried hole pad: 0.457mm Evaluation only. Created with Aspose.Slides for .NET 3.5 Client Profile 5.2.0.0. Copyright 2004-2011 Aspose Pty Ltd. C Company design - 8 layers with 1+6+1 Outer layer copper: 0.25mm Solder mask Pad: 0.325mm Buried hole: 0.2mm Buried hole pad: 0.5mm Evaluation only. Created with Aspose.Slides for .NET 3.5 Client Profile 5.2.0.0. Copyright 2004-2011 Aspose Pty Ltd. D Company design - 10 layers with 2+6+2 ( Copper filled) Outer layer copper: 0.25mm Solder mask Pad: 0.25mm Buried hole: 0.2mm Buried hole pad: 0.4mm Evaluation only. Created with Aspose.Slides for .NET 3.5 Client Profile 5.2.0.0. Copyright 2004-2011 Aspose Pty Ltd. A company design Flash type : 137 pin Outer layer line : 0.1 mm Second layer line : 0.075mm Evaluation only. Created with Aspose.Slides for .NET 3.5 Client Profile 5.2.0.0. Copyright 2004-2011 Aspose Pty Ltd. B company design Flash type : 137 pin Outer layer line : 0.75 mm with in BGA, 0.1mm within Flash Second layer line : 0.75 mm with in BGA, 0.1mm within Flash Evaluation only. Created with Aspose.Slides for .NET 3.5 Client Profile 5.2.0.0. Copyright 2004-20

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