Expa和nded uncertainty (mm) MMC = 0.040, Camera = 0.104, Exascan = 0.230, CT = 0.295 and Atos = 0.025.docVIP

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2017-01-20 发布于福建
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Expa和nded uncertainty (mm) MMC = 0.040, Camera = 0.104, Exascan = 0.230, CT = 0.295 and Atos = 0.025.doc

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Automated contract time determination system for highway projects??Original Research ArticleAutomation in Construction, Volume 18, Issue 7, November 2009, Pages 957-965Hyung Seok Jeong, Siddharth Atreya, Garold D. Oberlender, BooYoung Chung ?Show preview??|?? Purchase PDF (761 K) ??|?? Related articles??|??Related reference work articles???? 617 4D dynamic construction management and visualization software: 1. Development??Original Research ArticleAutomation in Construction, Volume 14, Issue 4, August 2005, Pages 512-524K.W. Chau, M. Anson, J.P. Zhang ?Show preview??|?? Purchase PDF (914 K) ??|?? Related articles??|??Related reference work articles???? 618 Impact life prediction modeling of TFBGA packages under board level drop test??Original Research ArticleMicroelectronics and Reliability, Volume 44, Issue 7, July 2004, Pages 1131-1142Tong Yan Tee, Hun Shen Ng, Chwee Teck Lim, Eric Pek, Zhaowei Zhong ?Close preview??|?? Purchase PDF (486 K) ??|?? Related articles??|??Related reference work articles???? AbstractAbstract | Figures/TablesFigures/Tables | ReferencesReferences Abstract Reliability performance of IC packages during drop impact is critical, especially for handheld electronic products. Currently, there is no model that provides good correlation with experimental measurements of acceleration and impact life. In this paper, detailed drop tests and simulations are performed on TFBGA (thin-profile fine-pitch BGA) and VFBGA (very-thin-profile fine-pitch BGA) packages at board level using testing procedures developed in-house. The packages are susceptible to solder joint failures, induced by a combination of PCB bending and mechanical shock during impact. The critical solder ball is observed to occur at the outermost corner solder joint, and fails along the solder and PCB pad interface. Various testing parameters are studied experimentally and analytically, to understand the effects of drop height, drop orientation, number of PCB mountin