QT-Ver. Stencil Design Guideline【DOC精选】.doc

三阶文件1.Product Revision 产品版本 Product Name产品名称 Applicable Product BOM Revision 适用的产品BOM版本 2.Change history更改记录 Updated Ver.最新版本 Effective date 生效日期 Prepared by起草人 Brief of Amendments 更改内容摘要 3.Purpose目的 This document defines design standards for solder paste printing and adhesive printing to be used at ENICS Suzhou. 4.Scope范围 ENICS Manufacturing Technology Department is the owner of this document. Any proposed changes to this document must be submitted and approved by ENICS Manufacturing Technology Department before incorporation. 5.Definitions定义 IPC-7525 Stencil Design Guidelines 6.Responsibilities职责 SMT Engineer is responsible for fabricating or modifying the stencils. 7.Description描述 Solder Paste/Adhesive Printer Application This document assumes the use of a printer platform that utilizes a 29” x 29” O.D. stencil frame size. For other stencil sizes, please consult ENICS Manufacturing Engineering. Stencil Foil Thickness` The relation between the surface of the aperture and the inside surface of the aperture walls in the stencil is critical in getting good transfer of the solder paste. ENICS targets an Area Aspect Ratio (AAR) ≥ 0.66 for SnPb and ≥ 0.70 for RoHS compliant processes for standard laser cut / electropolished stencils. If during design by the vendor the AAR rule is violated, consultation with ENICS is required to determine if a thinner stencil or step-up/step-down stencil should be deployed. A review of components with ground or thermal pad requirements should be conducted before selecting a stencil thickness as some components have relatively high standoff from the board. See section 7.13. Standard -- 0.005” Adhesive stencil – 0.01” 0.012” suggested when component packages to be glued have standoff from the PCB. Step Stencils Based on the relationship of Area Ratio on Transfer Efficiency, influencing paste release and volumetric repeatability, chang