Analysis procedure.ppt

Customer returned sample analysis procedure Content 1. Flow chart 2. Analysis procedure description 3. Introduction to product structure 4. Product die/wire bond spec 5. Electrical function spec description 6. Problem introduction and study 7. Instrument application 1. Flow chart 2. Analysis procedure description-1 1. Customer (production line) provide defective sample. 2. Verify sample spec inquire customer where defective problem occurs, used product condition and problem. 3. Inspect sample visual status and take photo for record file. 4. Test sample electrical function and verify with production line F/T tester then file record. 2. Analysis procedure description-2 5. For good sample checked by function test, conduct burn in test for product quality verification. 6. For samples confirmed as failure, conduct further analysis. 7. Conduct sample D.S.C test then file record. 8. Grind sample epoxy to inspect internal visual then take photo for record file. 2. Analysis procedure description-3 9. Decap sample epoxy to verify cause of problem or check cause which cannot be observed under visual inspection. 10. If inside plant analysis cannot find cause, then submit sample to outside organization for further analysis. (Material supplier or other analysis institution) 11. Summarize analysis data as report 12. Feedback to related department or customer. 3. Introduction to product structure 1. Lead frame or PCB 2. Chip or IC 3. Gold or Al wire 4. Silver paste 5. Epoxy 4. Product die/wire bond spec-1 Current general spec for die bond (Lamp device) : (Please refer to SOP document : SOP-1-041-D1 ) Chip tilted : Acceptable criteria ?Z ≦5 degree. Chip broken : Acceptable criteria : Broken area in both upper down side ≦1/5 P/N junction cannot be damaged. 4. Product die/wire bond spec-2 Silver paste too high or low : Acceptable criteria : Silver paste height of each chip side : Between 1/3 chip height and 1/2 chip height. Silver paste