chapter 3 tehnology of micro-fabricationchapter 3 technology of micro-fabricationchapter 3 technology of micro-fabricationchapter 3 technology of micro-fabrication.ppt

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chapter 3 tehnology of micro-fabricationchapter 3 technology of micro-fabricationchapter 3 technology of micro-fabricationchapter 3 technology of micro-fabrication.ppt

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调研报告针对中国国内MEMS 研究的调研第一组: 清华大学第二组: 北京大学第三组：上海微系统研究所第四组：上海交大微纳研究院 ? 写出关于该校MEMS研究的调查报告简要介绍该学校与 MEMS 相关的研究机构及主要研究成果(产品) 介绍该学校(研究所) 的 MEMS相关仪器设备、研究方向及近五年发表的有影响的论文等. PPT报告(10分钟)。每组出一个人作报告. 3.1 Traditional ultra-precision process and special process Tradition ultra-precision process Using the traditional process tools (such as boring-lathe, milling cut, buffing lathe, lathe-cut, etc..) to produce the MEMS. Advantage: All kind of material 3-D and complicated micro-device. Disadvantage: incompatible with IC Special process Un-touch without much more strain during process Like as electrical-discharge , laser process , electron beam, ion-beam etc.. High-ratio and high-precision 3.1.1 Ultra-precision machine process Three are some kinds of process technology as following: (1)Micro-drilling, mini drill with 2.5um diameter, can be vibrating during process (2)Micro-milling cutting , mini milling cutter diameter: 75um(US) (3)Minuteness cutting, CBN, Diamond. (4)Grind-polishing, silicon wafer polishing Typical tool: Micro-drilling L-4.8 mm W-1.8 H-1.7 Desktop Fabrication Systemfor producing micro ball bearings 3.1.2 Micro-electric-discharge Manufacture mEDM Using the pulse - discharge generating high-temperature in short time to process object. application: drilling, cutting, etc.. Wire electrical-discharge grind (WEDG). Piece electrode be substituted with wire electrode. 3.1.3 micro-machine process with higher energy beam Using high energy beam to treat materials -----method, Such as using laser, electron beam and ion beam with higher energy. Un-touch, no-strain, all kinds of materials. Laser process Electron beam process (heating) Electron beam process (no-heating) Ion beam process 3.2 MEMS fabrication technologyIC process The fabrication process of MEMS based on the IC is borrowed from the process of Integrated Circuit. IC process: wafer process: Single silicon produced, Cutting, Grind-