Silicon Pixel Detector RD for a Beam Profile Monitor硅像素探测器的RampD for a梁剖面监测.pptVIP

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Silicon Pixel Detector RD for a Beam Profile Monitor硅像素探测器的RampD for a梁剖面监测.ppt

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SiliconPixelDetectorRDforaBeamProfileMonitor硅像素探测器的R

XTEST2 A first Belle Pixel Readout Prototype Overview XTEST2A Status In Fab. @ HP, due back 11/10 LCPIX0 Design LCPIX0 design parameters LCPIX0 proposed architecture Pre-amp performance Comparator choice and performance Hit time encoding Performance simulations Summary of performance Remaining design work HP0.5um Oct. 2, Nov. 6 XTEST2 Radiation Results Radiation hardness consistent with Tox Quite adequate total dose performance XTEST2 Initial Prototype Problems 1: Gray-code Counter Problems 2: LVDS Driver XTEST2 Performance Results Successes: 2 key analog issues comparator works radiation tolerance Failures: GCC + LVDS nENC logic DRC/LVS Redesigns: better power distrib. D-FF, dynamic FFs replaced probe pads cleaned up wiring SPICE Sim.: front-to-back SPICE example waveforms XTEST2A Encoding Pair Monitor Specifications Pixel rather than strip (occupancy) Fast collection time -- 3D Pixel Trapezoidal geometry Radiation hard Simulation Input Previous simulation results: Reduction of drift time - model for SPICE input? Range/spread of amplitudes/risetimes for TWC? LCPIX0 Footprint Design LCPIX0 to match sensor currently being fabbed: Readout Electronics progress Gaining experience in design/test of XTEST2, a pixel upgrade effort: Belle Vertexing Upgrade XTEST2 Design Concept Simple readout structure Decent performance w/o pre-amp (see below) Comparator powering during encoding 5-bit Wilkenson encoding (1mV/ms ~ 40ms) After encoding, fast LVDS data transfer out Expected Performance Interconnect Concerns LCPIX0 Design Specifications: BX timing possibility TWC implementations Encoding Options: analog ramp TDC 1-2ns resolution LCPIX0: Submit in 3 months same process as XTEST2 proto chips early ‘01 Bump Bonding Tests Global tender: only 2 companies willing to work with thin devices: AIT (Hong Kong) GEC-Marconi (U.K.) GEC withdrew ARO Concern for LHC community also Bonded both 300mm and 100mm thick devices Bump Bonding Results (1) Sample measurement: Bump bondin