Numerical simulation of stick-slip contact line motion and particle line formation in dip coating.pdfVIP

Numerical simulation of stick-slip contact line motion and particle line formation in dip coating.pdf

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International Communications in Heat and Mass Transfer 74 (2016) 98–107 Contents lists available at ScienceDirect International Communications in Heat and Mass Transfer journal homepage: /locate/ichmt Numerical simulation of stick-slip contact line motion and particle line formation in dip coating? Jaewon Lee, Gihun Son* Department of Mechanical Engineering, Sogang University, Seoul, South Korea ARTICLE INFO Available online 16 March 2016 Keywords: Contact line Dip coating Level-set method Particle line Stick-slip ABSTRACT Numerical simulation is performed for stick-slip contact line motion and particle line formation in dip coating. The liquid–gas interface as well as the liquid–gas–solid contact line is tracked by a sharp-interface level-set method, which is extended to include the effect of phase change, to implement the contact angle model for the stick-slip contact line motion, and to treat the particle deposition on a moving substrate. The computations demonstrate that the particle line formation is directly related to the stick-slip contact line motion. The effects of initial particle concentration, substrate withdrawal velocity, substrate temperature and contact angle on the particle line formation in dip coating are investigated. ? 2016 Elsevier Ltd. All rights reserved. 1. Introduction Dip coating in the evaporation regime, where a substrate is slowly pulled up from an evaporating liquid pool, has received considerable attention as a simple particle deposition process for patterning of microscale stripes or lines. The particle line patterning is related to the periodic stick-slip motion of the liquid–gas–solid contact line, as optically observed in several studies [1-5]. However, a fundamental understanding and prediction of the stick-slip contact line motion and the associated particle line deposition process is lacking in the literature. Ghosh et al. [6] conducted experiments for line patterning by dip coating of colloidal particles and showed that perio

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