等离子技术-培训讲稿.pptVIP

什么是等离子体What is a Plasma? Fourth State of Matter 表面反应机理: 物理反应Surface Reaction Mechanisms: Physical Physical Sputtering - Argon Plasma Substrate Placed on (-) Electrode Ar+ Ion Attracted to (-) Electrode Impact Force Removes Contamination Advantages Non-Chemical Reaction: No Oxidation Pure Substrate Remaining Disadvantages - Easy to Minimize Substrate Damage: Impact, and Overheating Poor Selectivity Low Etch Rate Contaminant Redeposition 表面反应机理: 化学反应Surface Reaction Mechanisms: Chemical Plasma Generated Reactive Chemical Species Source Chemicals Include: H2, O2 and CF4 Ionized So