anticaf技术资料汇整.docVIP

一、文獻標準參考資料 : 文獻 規範 溫/濕度條件 外加電歷 時間 JIS-Z-3197 Testing Method for Resin Type、Soldering、Flux 40℃ 90~95%RH DC100V Off Line Test 96 hr JIS-Z-3284 Solder paste (Migration Test) 40℃ 90~95%RH 85℃ 85~90%RH DC50V On Line Test 1000 hr Solder paste (Insulation Resistance Test) 40℃ 90~95%RH 85℃ 85~90%RH DC100V On Line Test 168 hr IPC-TM-650 (2.6.3) Moisture and Surface、 Insulation Resistance、Fluxes 85±2℃ 85%±2RH DC45~50V On Line Test 96~168 hr 35℃ 85~93%RH DC100V On Line Test 96 hr 50℃ 85~93%RH DC100V On Line Test 168 hr MIL-F-14256 Flux、Soldering、Resin Base 85℃ 85%RH DC50V On Line Test