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MicroIntegration Technology Solutions for Protection in High Speed IO Data Lines.pdf

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MicroIntegration Technology Solutions for Protection in High Speed IO Data Lines

? Semiconductor Components Industries, LLC, 2002 November, 2002 - Rev. 0 1 Publication Order Number: AND8104/D AND8104/D MicroIntegration Technology Solutions for Protection in High Speed I/O Data Lines Prepared by: Alejandro Lara ON Semiconductor Applications Engineer INTRODUCTION Static electricity conditions (ESD) can cause catastrophic damage to I/O ports, IC malfunction, and worst of all, ghost data bits in electronic systems. When product damage or product malfunction results in a “Hard failure” or destroyed component, it is easy to isolate and replace the failed component and put the system back in service, however, if a “soft failure” occurs (CMOS component degraded), the system anomaly is not detected in retesting, and hours are wasted in troubleshooting because the system continues to produce irregular data bits. Such failures have a very negative impact in the final product because they increase the cost of warranty repairs and diminish the perception of the product’s quality. These days, our modern society has rapidly come to fully depend on electronics. And modern computers are based increasingly on low power logic chips, all with ESD sensitivity due to MOS dielectric breakdowns and bipolar reverse junction current limits. The ICs that control I/O ports (USB, Ethernet, etc.) are not an exception since the majority of them are designed and manufactured based on CMOS processes which make them extremely sensitive to damage from ESD conditions. Because the majority of I/O ports are hot insertion and removal systems, they are extremely vulnerable to receive ESD conditions possibly generated by the users or by air discharges. Users can induce ESD conditions while plugging or unplugging any cables, and air discharges can happen a few inches away from the conducting surface. In addition to all the previous problems caused by static discharge conditions in unprotected ICs, ESD protection now is becoming a strong requirement mainly in the European market, which