HeatSink Stencil Printing assembly.ppt

CONTINUOUS IMPROVEMENTTitle: Heatsink Glue Printing Jig Presenter : SC Yap Date : 01/25/2007 (Presentation format no.1) PROBLEM STATEMENT Current methodology use for glue dispensing onto heatsink have leads to many issues as below: Excessive glue being apply to the heatsink. This has lead to cosmetic rejects of the heatsink surface. low productivity due to operator need to manually and slowly control on the glue dispense to the heatsink. Yield Drop at FNI due to Excessive glue. 1.Improvement Methodology- Heatsink Printing Jig Step 1 : Open up the stencil frame and place the heatsink onto the opening of the stencil. Step 2 : Close back the stencil frame. Step 3 : Apply glue to the stencil. Step 4 : Use the squeeze to remove the excessive glue and spread the glue evenly to the heatsink. Step 5 : Final results shows that the heatsink being apply with sufficient glue, neat and tidy. 2.Improvement Methodology- Heatsink Printing Jig OLD AND NEW METHODOLOGY COMPARISON Old Method – Manual heatsink glue dispense New Method – Heatsink glue printing jig Inaccurate glue dispense quantity. Causing insufficient / excessive glue dispense to the heatsink. Consistent quantity of glue dispense to the heatsink due to dimension of the stencil opening has limit the excessive / insufficient glue apply Glue not spread out evenly on the heat sink surface. The use of squeeze enable the glue to be spread evenly on the heatsink. Need operator to perform checking of every heatsink after glue has been apply. Operator only required to clean the stencil after 30 pieces of heatsink with glue produce. Low productivity due to only 1 pcs of heatsink with glue able to produce at 1 time. Higher productivity due to 6 pcs of heatsink with glue able to produce at 1 time. 1 stencil consist of 6 heatsink opening. Operator hard to control and methodology not feasible to use under mass production Easier to control by operator and methodology feasible to be use under mass production INTANGIBLE BENEFITS