ASC_RFDIP1608060LNT_V01.pdf

Approval sheet Page 1 of 7 ASC_RFDIP1608060LNT_V01 Feb. 2014 RFDIP Series – 1608(0603)- RoHS Compliance MULTILAYER CERAMIC DIPLEXER Halogens Free Product 2.4 GHz 5 GHz ISM Band Working Frequency P/N: RFDIP1608060LNT *Contents in this sheet are subject to change without prior notice. Approval sheet Page 2 of 7 ASC_RFDIP1608060LNT_V01 Feb. 2014 FEATURES 1. Miniature footprint: 1.6 X 0.8X 0.6 mm 3 2. Low Insertion Loss 3. High attenuation on 2 nd harmonic suppressed 4. LTCC process APPLICATIONS 1. ISM 2.4/ 5GHz band RF application 2. Wi-Fi 802.11a/b/g/n application CONSTRUCTION DIMENSIONS Figure Symbol Dimension (mm) L 1.60 ± 0.15 W 0.80 ± 0.15 T 0.60 ± 0.10 A 0.175 ± 0.15 B 0.25 ± 0.15 C 0.25 ± 0.15 D 0.50 ± 0.15 E 0.20 ± 0.15 PIN Connection PIN Connection 1 2.4GHz Port 4 GND 2 GND 5 Common Port 3 5GHz Port 6 GND P4 P5 P6 P1 P2 P3 Top view Top view Bottom view Side view Approval sheet Page 3 of 7 ASC_RFDIP1608060LNT_V01 Feb. 2014 ELECTRICAL CHARACTERISTICS Item Specification Frequency range (MHz) 2400-2500 4900-5950 VSWR 2.0 max 2.0 max Insertion Loss (dB) 0.5 dB max. 0.6 dB max Attenuation (dB min.) 10 dB @ 3600~3750 MHz 20 dB @ 4800~5000 MHz 20 dB @ 5000~5950 MHz 10 dB @ 7200~7500 MHz 10 dB @ 9600~10000MHz 25 dB @ 860~960 MHz 25 dB @ 1545~1605 MHz 25 dB @ 1710~1990 MHz 30 dB @ 2170 MHz 10 dB @ 8100~8800 MHz 15 dB @ 8820~9800 MHz 25 dB @ 9800~11900 MHz Isolation
25 dB @ 2400 ~ 5000MHz Operation Temperature Range -40°C ~ +85°C TYPICAL ELECTRICAL PERFORMANCE S-Parameter SOLDER LAND PATTERN Figure Unit : mm Line width to be designed to match 50 Ω characteristic impedance, depending on PCB material and thickness. Approval sheet Page 4 of 7 ASC_RFDIP1608060LNT_V01 Feb. 2014 RELIABILITY TEST Test item Test condition / Test method Specification Solderability JIS C 0050-4.6 JESD22-B102D *Solder bath temperature：235 ± 5°C *Immersion t