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irg7ph42udpbf
INSULATED GATE BIPOLAR TRANSISTOR WITH
ULTRAFAST SOFT RECOVERY DIODE
IRG7PH42UDPbF
IRG7PH42UD-EP
1
10/26/09
E
G
n-channel
C
VCES = 1200V
IC = 45A, TC = 100°C
TJ(max) = 150°C
VCE(on) typ. = 1.7V
Features
? Low VCE (ON) trench IGBT technology
? Low switching losses
? Square RBSOA
? 100% of the parts tested for ILM
? Positive VCE (ON) temperature co-efficient
? Ultra fast soft recovery co-pak diode
? Tight parameter distribution
? Lead-Free
Benefits
? High efficiency in a wide range of applications
? Suitable for a wide range of switching frequencies due to
low VCE (ON) and low switching losses
? Rugged transient performance for increased reliability
? Excellent current sharing in parallel operation
Applications
? U.P.S.
? Welding
? Solar Inverter
? Induction Heating G C E
Gate Collector Emitter
TO-247AC
IRG7PH42UDPbF
TO-247AD
IRG7PH42UD-EP
G C
E
C
G C
E
C
Absolute Maximum Ratings
Parameter Max. Units
VCES Collector-to-Emitter Voltage 1200 V
IC @ TC = 25°C Continuous Collector Current (Silicon Limited) 85
IC @ TC = 100°C Continuous Collector Current (Silicon Limited) 45
INOMINAL Nominal Current 30
ICM Pulse Collector Current, VGE = 15V 90 A
ILM Clamped Inductive Load Current, VGE = 20V 120
IF @ TC = 25°C Diode Continous Forward Current 85
IF @ TC = 100°C Diode Continous Forward Current 45
IFM Diode Maximum Forward Current 120
VGE Continuous Gate-to-Emitter Voltage ±30 V
PD @ TC = 25°C Maximum Power Dissipation 320 W
PD @ TC = 100°C Maximum Power Dissipation 130
TJ Operating Junction and -55 to +150
TSTG Storage Temperature Range °C
Soldering Temperature, for 10 sec. 300 (0.063 in. (1.6mm) from case)
Mounting Torque, 6-32 or M3 Screw 10 lbf·in (1.1 N·m)
Thermal Resistance
Parameter Min. Typ. Max. Units
RθJC (IGBT) Thermal Resistance Junction-to-Case-(each IGBT) ––– ––– 0.39
RθJC (Diode) Thermal Resistance Junction-to-Case-(each Diode) ––– ––– 0.56 °C/W
RθCS Thermal Resistance, Case-to-Sink (flat, greased surface) ––– 0.24 –––
RθJA Thermal Resistance,
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