WaferSurfaceGrindingMachineModelGCG300-GCG300.PDFVIP

Introduction of Product Introduction of Wafer Surface Grinding Machine Model GCG300 Junichi Yamazaki Meeting the market requirements for silicon wafers with high flatness and minimal damage, which have become increasingly stringent in the face of highly integrated semiconductor devices, a fully automated surface grinding machine has been developed and introduced into the market, where it is making a contri- bution in high volume production lines in semiconductor plants. The background to the development and technologies used in the grinding machine are described and the product profile is presented. Key Words: silicon wafer, high flatness, low-damage grinding, high productivity, ultraprecision grinding, high loop rigidity, air spindle, nanolevel micro feed 1. Introduction The integration of MPUs, memories and other semicon- Against this backdrop, a 300mm-diameter wafer surface ductor devices is further accelerated. This requires silicon grinding machine model GCG300 has been developed based wafers to be higher in flatness with minimal damage. The on the development technology for a 200mm-diameter wafer manufacturing process to meet these requirements has been grinding machine manufactured to implement the grinding researched. From the standpoint of securing a flatness of technology propelled under a cooperative project undertaken high accuracy before final polishing, prior research has jointly by four companie