CHAPTER8-PARTSMOUNTING.pdfVIP

NASA-STD-8739.3 December 1997 CHAPTER 8 - PARTS MOUNTING 8.1 General Parts, terminals, and conductors shall be mounted and supported as prescribed herein. Dimensions provided in this chapter are for acceptance and/or rejection criteria only. Unusual environmental applications require special design measures to provide necessary environmental survival capability. Such measures shall be detailed on the appropriate engineering documentation. Engineering documentation shall prescribe which alternative approach is selected, as well as staking compounds and conformal coating requirements. They shall also detail any special mounting arrangements or design requirements not fully covered herein. 1. Stress Relief. Stress relief shall be incorporated, wherever possible, into all leads and conductors terminating in solder connections to provide freedom of movement of part leads or conductors between points of constraint. Leads shall not be temporarily constrained against spring-back force during solder solidification so that the joint is subject to residual stress. Examples of stress relief are shown in figures throughout this chapter. 2. Part Positioning. Parts shall be positioned in compliance with the engineering documentation and mounted in accordance with the requirements specified herein. a. Parts shall be mounted so that terminations of other parts are not obscured. When this is not possible, interim assembly inspection shall occur to verify that the obscured solder joints meet the requirements herein. b. Parts having conductive cases mounted over printed conductors or which are in close proximity with other conductive materials shall be separated by insulation of suitable thickness. Insulati