软硬结合板压合垫的选择与技术要领.pptVIP

* 东莞市科畅力电子有限公司 *软硬结合板层压与层压缓冲垫控制要点 常见结构及工艺流程（1+HDI 6L） 1+1R+2F+1R+1 ：1+HDI结构的硬板夹软板结构 NF PP Open – Plasma – B.O. – Pressing(L2L34L5) – Mech. Drill – De-burr – De-smear – PTH+ Flash –Panel Plate—IL D/F – DES – AOI —B/O L25 Board cutting—I/L D/F—DES（蚀刻单面）— PE Punch—AOI—B/O（Core厚大于0.2mm，需要在B/O前做预激光切割） L2/L5 Pressing—Laser Drill—Mech. Drill – De-burr – De-smear – PTH+ Flash —ODF—Pattern Plate—SES—AOI—S/M – C/M – ENIG –Pre-Routing – Laser De-cap – Laser Routing – Routing – ET – Pressing stiffener– FQC – Packing L16 Board cutting –I/L D/F – I/L exposure – DES ---–– AOI– B.O. – Sticking Cover lay – Pressing cover lay – Measuring expansion Coefficient – PE Punch --FQC L3-L4 常见结构及工艺流程（2+HDI 6L） 1+1F+2F+1F+1 ：2+HDI结构 NF PP Open – Plasma – B.O. – Pressing(L2L34L5) – Laser Drill –– De-smear – PTH+ Flash –Panel Plate—IL D/F – DES –UV Cut PI -- AOI —B/O L25 Board cutting (Single side FCCL Preparation) L2/L5 Pressing—Laser Drill—Mech. Drill – De-burr – De-smear – PTH+ Flash —Panel Plate—D/F--- DES—AOI—S/M – C/M – ENIG –Pre-Routing – Laser De-cap – Laser Routing – Routing – ET – Pressing stiffener– FQC – Packing L16 Board cutting –Mech. Drill–Shadow-- Button Image– Button plate -- I/L D/F – I/L exposure – DES –– AOI– B.O. – Sticking Cover lay – Pressing cover lay – ENIG– Punch Finger--Measuring expansion Coefficient –PE Punch -- FQC L3-L4 1+HDI硬板夹软板的层压结构 常见结构及工艺流程（1+HDI 8L） NF PP Open – Plasma – B.O. – Pressing(L23L45L67) – Mech. Drill –– De-smear – PTH+ Flash –Panel Plate—IL D/F – DES – AOI —B/O L27 Board cutting – I/L DF– IL exposure– DES– PE Punch --- AOI—B.O. L23/L67 Pressing—Laser Drill—Mech. Drill – De-burr – De-smear – PTH+ Flash —Panel Plate—D/F--- DES—AOI—S/M – C/M – ENIG –Pre-Routing – Laser De-cap – Laser Routing – Routing – ET – Pressing stiffener– FQC – Packing L16 Board cutting –I/L D/F – I/L exposure – DES –AOI – B.O. – Sticking Cover lay – Pressing cover lay –Measuring expansion Coefficient – PE Punch -- FQC L4-L5 两次压合 2+HDI 硬板夹软板的结构 常见结构及工艺流程（2