Challenges in the Assembly and Handling of Thin Film Capped MEMS Devices.docVIP

Sensors 2010, 10, 3989-4001; doi:10.3390/s100403989 OPEN ACCESS sensors ISSN 1424-8220 /journal/sensors Review Challenges in the Assembly and Handling of Thin Film Capped MEMS Devices Jeroen J. M. Zaal *, Willem D. van Driel and G.Q. Zhang Delft University of Technology, Department PME, Mekelweg 2, 2628 CD Delft, The Netherlands; E-Mails: Willem.van.Driel@P (W.D.v.D.); G.Q.Zhang@TUDelft.nl (G.Q.Z.) * Author to whom correspondence should be addressed; E-Mail: J.J.M.Zaal@TUDelft.nl; Tel.: +31-24-353-2863; Fax: +31-24-353-3350. Received: 5 January 2010; in revised form: 8 March 2010 / Accept