材料学相关论文.pdfVIP

第19 卷 第5 期 传 感 技 术 学 报 Vol. 19 No. 5 2 006 年10 月 CHINESE JOURNAL OF SENSOR S AND ACTUATORS Oct . 2006 Finite Element Analysis on Solder Joint Stress of BGA under Shock Load * ZHANGJie ,YANG Ping (Micro/Nano Scienceand Technology Research Center, J iangsu niversity, Zhenj iang J iangsu 212013, China) Abstr act: The dynamic r esponse of PBGA ( plastic ball rid array) assembly under hi h acceleration