- 1、本文档共15页,可阅读全部内容。
- 2、原创力文档(book118)网站文档一经付费(服务费),不意味着购买了该文档的版权,仅供个人/单位学习、研究之用,不得用于商业用途,未经授权,严禁复制、发行、汇编、翻译或者网络传播等,侵权必究。
- 3、本站所有内容均由合作方或网友上传,本站不对文档的完整性、权威性及其观点立场正确性做任何保证或承诺!文档内容仅供研究参考,付费前请自行鉴别。如您付费,意味着您自己接受本站规则且自行承担风险,本站不退款、不进行额外附加服务;查看《如何避免下载的几个坑》。如果您已付费下载过本站文档,您可以点击 这里二次下载。
- 4、如文档侵犯商业秘密、侵犯著作权、侵犯人身权等,请点击“版权申诉”(推荐),也可以打举报电话:400-050-0827(电话支持时间:9:00-18:30)。
- 5、该文档为VIP文档,如果想要下载,成为VIP会员后,下载免费。
- 6、成为VIP后,下载本文档将扣除1次下载权益。下载后,不支持退款、换文档。如有疑问请联系我们。
- 7、成为VIP后,您将拥有八大权益,权益包括:VIP文档下载权益、阅读免打扰、文档格式转换、高级专利检索、专属身份标志、高级客服、多端互通、版权登记。
- 8、VIP文档为合作方或网友上传,每下载1次, 网站将根据用户上传文档的质量评分、类型等,对文档贡献者给予高额补贴、流量扶持。如果你也想贡献VIP文档。上传文档
查看更多
Effect of Electrical Contact on the Contact Residual Stress of a Microrelay Switch
Sensors 2007, 7, 2997-3011
sensors
ISSN 1424-8220
? 2007 by MDPI
/sensors
Full Research Paper
Effect of Electrical Contact on the Contact Residual Stress of a
Microrelay Switch
Yung-Chuan Chen 1, Hsun-Heng Tsai 2 , Wei-Hua Lu 3 and Li-Wen Chen 1,*
1 Department of Vehicle Engineering, National Pingtung University of Science and Technology,
Pingtung, Taiwan, E-mail: chuan@.tw.
2 Department of Biomechatronics Engineering, National Pingtung University of Science and
Technology, Pingtung, Taiwan, E-mail: heng@.tw
3 Department of Material Engineering, National Pingtung University of Science and Technology,
Pingtung, Taiwan, E-mail: whl@.tw
* Author to whom correspondence should be addressed: E-mail: liwen@.tw
Received: 12 October 2007 / Accepted: 14 November 2007 / Published: 26 November 2007
Abstract: This paper investigates the effect of electrical contact on the thermal contact
stress of a microrelay switch. A three-dimensional elastic-plastic finite element model with
contact elements is used to simulate the contact behavior between the microcantilever beam
and the electrode. A model with thermal-electrical coupling and thermal-stress coupling is
used in the finite element analysis. The effects of contact gap, plating film thickness and
number of switching cycles on the contact residual stress, contact force, plastic deformation,
and temperature rise of the microrelay switch are explored. The numerical results indicate
that the residual stress increases with increasing contact gap or decreasing plating film
thickness. The results also show that the residual stress increases as the number of switching
cycles increases. A large residual stress inside the microcantilever beam can decrease the
lifecycle of the microrelay.
Keywords: Microrelay, electrical contact, thermal-electrical coupling, thermal-stress
coupling, elastic-plastic finite element model.
Sensors 2007, 7
2998
1. Introduction
Microrelays ar
您可能关注的文档
- Economic evaluation of health consequences of prenatal methylmercury exposure in France.doc
- Economic Growth, Capitalism and Unknown Economic Paradoxes.doc
- Ecosystem Management Tomorrow’s Approach to Enhancing Food Security under a Changing Climate.doc
- Economy and Sustainability—How Economic Integration Stimulates Stringent Environmental Regulations.doc
- Ecosystem-Based Adaptation to Climate Change in Caribbean Small Island Developing States Integrating Local and External Knowledge.doc
- Ecosystem Services and Food Security Economic Perspectives on Environmental Sustainability.doc
- Economic modeling of the combined effects of HIV-disease, cholesterol and lipoatrophy based on ACTG 5142 trial data.doc
- Ecrg4 expression and its product augurin in the choroid plexus impact on fetal brain development, cerebrospinal fluid homeostasis and neuroprogenitor cell response to CNS injury.doc
- Ecotourism versus Mass Tourism. A Comparison of Environmental Impacts Based on Ecological Footprint Analysis.doc
- Ectopic corticotropin-releasing hormone (CRH) syndrome from metastatic small cell carcinoma a case report and review of the literature.doc
文档评论(0)