高体积分数SiC／Cu复合材料的研究进展.pdfVIP

维普资讯 学兔兔 第26卷第3期 粉末冶金技术 Vo1．26．No．3 2008年6月 Powder Metallurgy Technology Jun．2008 高体积分数SiC／Cu复合材料的研究进展 章 林 曲选辉一 何新波 段柏华 (北京科技大学材料科学与工程学院，北京 100083) 摘 要：‘高体积分数SiC／Cu复合材料具有热导率高、热膨胀系数低、耐磨性优异及可焊性好等优点，在电子 封装及摩擦磨损领域有很大的应用潜力。本文综合评述了SiC／Cu复合材料的制备技术，详细阐述了SiC— cu的润湿性、界面反应及活性润湿的机理，指出了SiC／Cu复合材料的发展方向和应用前景。 关键词：SiC／Cu复合材料；界面反应；润湿性 Research progress in SiC／Cu composites Zhang Lin，Qu Xuanhui，He Xinbo，Duan Bohua (School of Materials Science and Engineering，University of Science and Technology Beijing，Beijing 100083，China) Abstract：SiC／Cu composites with high content of reinforcements exhibit high thermal conductivity，low coefficient of thermal expansion，good wear resistance and excellent welding properties．These characteristics make SiC／Cu more attractive in electronic packaging and wear resistance materials application．In this paper，the synthesis methods and their properties were introduced，The wettability，the reaction between SiC and Cu and the mechanism of the reactive wetting between metal／ceramic were investigated in detail．At last，the research interests and the potential applications were discussed． Key words：SiC／Cu composite；interfacial reaction；wettability 高体积分数(50％～70％)SiC／Cu能综合Cu和 究SiC／Cu复合材料的关键是采用合适的工艺改善 SiC的优点，具有密度较低、热导率高、热膨胀系数 SiC和Cu的润湿性、控制界面反应、优化界面结构、 低、耐磨性优异的优点…。SiC的密度小、CTE低， 提高致密度和热导率。