IC失效性原理和分析方法及工具.pdfVIP

FAILURE ANALYSIS Prepared by: Sam LIU Failure Mechanisms Early life period. Infant mortality (extrinsic) failures. Wearout period. Cause: « wear out » of Wearout (intrinsic) failures. manufacturing defects: scratched Cause: wear out of devices metal, mask defect, poor step with no manufacturing defects. coverage, pinholes… Time dependant mechanisms: