S1000-2产品简介.pptVIP

广东生益科技股份有限公司 ◇ 高Tg、低介电常数覆铜板 S1000-2（Laminate）/ S1000-2B（Prepreg）: Laminate Tg (DSC) ≥170℃ Decomposition Temperature(Td) Z-axis Coefficient of thermal expansion Test T-288 Test T-300 Test Excellent anti-CAF performance Test Condition ：85℃/85%RH，DC 50V Sample Construction ：TH-TH 0.70 mm, Space 0.25 mm, L-L 0.10 mm Through-Hole reliability(Q1000) Permittivity and Loss Tangent General Property 粘结片指标（Prepreg Availability） 压合程序（Press Cycle） Press Parameters Heat-up rate We recommend you adopt slow heat rise rate when pressing multilayer boards. 1.5-2.5℃/min of heat-up rate at the rang of 80-140℃ is preferable. Curing time We recommend the curing time of S1000-2/S1000-2B should be over 60 minutes when the material temperature is 190 ℃. Pressing quantity Maximum 8-9 layers at every open is recommended. Desmear Parameters Remark: At desmear process,?increase the working time?or increase the working temperature is?preferable. Drill Parameters Thank you! ? ? S1000-2/S1000-2B 2005年3月25日 S1000-2/S1000-2B 低CTE高耐热性高Tg产品 Low CTE，Excellent thermal resistance Hi-Tg 产品特点（FEATURES） Available for lead-free process, meet IPC-4101B/126 requiremeet . High Tg 170℃(DSC) ,UV Blocking and AOI compatible. High thermal performance,Td≥340℃, T288＞20min ,T300＞5min . Low Z-axis CTE from ambient to 260℃. Excellent chemical resistance lower water absorption. Excellent CAF resistance. 应用领域(APPLICATIONS) Suitable for high-count layer PCB. Suitable for multilayer with heavy inner copper. Suitable for multilayer with BGA. Application for high layer count with high aspect tatio(1:8). Widely used in computer, communication equipmnt. precise apparatus and instrument, router, and etc 193 175 185 Typical Value Method re. SPEC Unit Treatment Condition Test Item --- Celsius DMA --- Celsius TMA IPC-TM-650 ≥170 Celsius DSC Glass transition temperature Tg 性能介绍（GENERAL PROPERTIES） IPC-TM-650 Method re. 348 ≥340 Celsius