电子元件封装术语大全-discourse-production.oss-cn.pdfVIP

电子元件封装术语大全 目录 1、BGA(ball grid array) 3 2、BQFP(quad flat package with bumper) 3 3、碰焊PGA(butt joint pin grid array) 表面贴装型PGA 的别称(见表面贴装型PGA)。...3 4 、C-(ceramic) 3 5、Cerdip 3 6、Cerquad 4 7、CLCC(ceramic leaded chip carrier) 4 8、COB(chip on board) 4 9、DFP(dual flat package) 4 10、DIC(dual in-line ceramic package) 4 11、DIL(dual in-line) 5 12、DIP(dual in-line package)5 13、DSO(dual small out-lint) 5 14、DICP(du