铜铝薄板轧制复合工艺.pdfVIP

第31卷 第5期 V o l31 No5 2 009年 10月 Journal of Shenyang University of Technology Oct 2 0 0 9 : 1000 1646( 2009) 05 0531 05 黄宏军, 张泽伟, 王书生, 袁晓光 ( , 110870) : , , ., , . : , , , . , , , . : ; ; ; ; ; ; ; : TG 335 : A Rollcladding technology for copperalum inum thin sheet HUANG Hongjun, ZHANG Z ewe,i WANG Shusheng, YUAN X iaoguang ( School of M aterials Science and Engineering, Shenyang U niversity of Techno logy, Shenyang 110870, China) Abstract: In order to meet the demand of electronic and heatradiating devices for CuA l com posite, the rollcladding technology for CuA l thin sheet w as developed. The corresponding ro llcladding technology w as optmi ized by the expermi ents. The vary ing regularity of thickness ratio in the rolling process of CuA l thin sheet w as studied. The change in the CuA l interface w as investigated by adopting different annealing technologies. The results show that the critical ro lling reduction rate for A lCu cladding decreases w ith increasing the thicknessproportion of Cu. The reduction rate of A l and Cu isproportional to total reduction rate. The reduction rate of A l and Cu increasesw ith increasing the rolling reduction rate. Annealing can enhance the bending performance of the thin sheet. However, when the annealing temperature is too high, the hard and brittle interm etallic com pounds form at the interface of Cu and A ,l which w ill deteriorate the bonding strength of CuA l cladding sheet. K ey words: CuA l cladding sheet; roll cladding; annealing strengthening; bending test; thickness ratio; interface; critical ro lling reduction rate; bonding strength ,