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Design and architecture of low-dielectric-constant organic–inorganic hybrids
PAPER /materials | Journal of Materials Chemistry
Design and architecture of low-dielectric-constant organic–inorganic hybrids
from octahydridosilsesquioxanes
Ben-hong Yang,ab Hong-yao Xu, *a Zhen-zhong Yangc and Xiang-yang Liud
Received 4th August 2009, Accepted 25th September 2009
First published as an Advance Article on the web 21st October 2009
DOI: 10.1039/b915872c
Molecular design and architecture of four novel organic–inorganic network hybrids were implemented
via hydrosilylative addition reaction of octahydridosilsesquioxanes (H8-POSS) with dienes. The
structural characterization by the FTIR, 13C MAS NMR and 29Si MAS NMR technologies,
respectively, indicates that two monomers are chemically bound to each other to form three-
dimensional network hybrids that possess well film-formability. Atomic force microscopy (AFM),
scanning electron microscopy (SEM) and transmission electron microscopy (TEM) show that no phase
separation occurred in the hybrid films, implying that the POSS molecules are uniformly dispersed into
the polymeric system at the nanoscale. All POSS-containing well-dispersed hybrid films exhibit a good
thermal stability with a decomposition temperature higher than 350 C, and enhanced mechanical
properties of a hardness of 0.21–0.26 GPa and the elastic modulus of 7.67–8.85 GPa, and low dielectric
properties with a dielectric constant of 2.43–2.78. Interestingly, these properties can be further tuned by
adjusting the length and the structure of the linking chain between POSS cages.
Introduction to disperse evenly in the matrix. Instead, they often deteriorate
the comprehensive properties of the composites.
The development of integrated circuit technology depends on the Polyhedral
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