LED固晶绝缘胶_DX-20.pdf

ECCOBOND DX-20-4 Dielectric Adhesive For GaN LED Chip Bonding Cure: Key Feature Benefit ECCOBOND DX-20-4 can be cured in 1 hour at • Strong adhesion • High reliability 170 °C. Oven has to be pre heated up to the specified cure temperature before use. The cure • No yellowing due to • Long-life LEDs time does not include warm up time. heat and light Instructions For Use: Thoroughly read the information concerning health Product Description: and safety contained in this bulletin before using. ECCOBOND DX-20-4 is a one-component dielectric Observe all precautionary statements that appear on adhesive, developed for GaN LED chip bonding. It the product label and/or contained in individual features good thermal and UV resistance, as well as Material Safety Data Sheets (MSDS). non-bleeding property. Applications: ECCOBOND DX-20-4 can be used with pin transfer, and dispensing. Properties of Material Property before cured Test Method Unit Value Chemical Type Epoxy/Silica Specific Gravity @ 25 ℃ TP-13 1.18 Appearance Visual Opaque Viscosity @ 25 °C, 10 rpm Cone-plate ty