等效热电路法计算阵列型高功率LED搭配散热鳍片模组 ... - 先进工程学刊.PDFVIP

先進工程學刊第四卷 第一期 89 Journal of Advanced Engineering Vol. 4, No. 1, pp. 89-96 / January 2009 等效熱電路法計算陣列型高功率LED搭配 散熱鳍片模組熱傳性能之研究 A Study of Heat-Sink Geometry on the Heat Transfer Performance of High-Power LED Modules Using Thermal Circuits Method * 黃建勝 李東哲 蔡瑞益 * J. S. Huang , T. C. Lee, R. Tsai 摘要 本研究使用熱電路法搭配CFD模擬高功率 LED陣列熱源搭配散熱鰭片，藉 由改變鰭片尺寸，分析晶片平均接點溫度，探討 LED在正向照明時搭配平板及圓 柱型鰭片，分析LED陣列的熱行為。結果顯示系統熱阻值隨著鰭片高度的增加而 減小，鰭片數目、厚度或直徑在此模型中則有其較佳區間，而熱電路法的預測與 CFD模擬的結果十分接近，誤差甚小。 關鍵詞 ：發光二極體(LED) ，晶片接點溫度，鰭片效率，計算流體力學，熱電路法 Abstract This study simulates high power LED array with two types of heat sink by CFD (Computational Fluid Dynamics) code and compares the results with adopting the method of thermal circuits. We analyze average junction temperature by selecting different size of heat sink and discuss the thermal behavior about LED array modules which are forward lighting with plate and cylinder pin fin heat sink. The results show that total thermal resistance decreases with higher fin height and the fin numbers, thickness and diameters locate on the optimum range. In addition, the prediction of thermal circuits is in good agreement with the simulation from CFD code. Keywords : light emitting diode (LED), junction temperature, fin efficiency, CFD,