焊膏用免清洗助焊剂的制备与研究王伟科.pdfVIP

27 1 8 　　　　　　　　　　　　　E lectron ics P ro ce ss Techno logy　　　　　　　　　　　　　　　2006 1　 　SMT /PCB　 王伟科,赵麦群,邬涛 (西安理工大学, 陕西　西安　7 10048) 　:根据免清洗助焊剂各组份的特点,分别 其活性剂、溶剂、成膜剂以及添加物进行筛选 和处理。在 一定温度下 各组份进行均匀化处理并制备出助焊剂, 依据标准 所制备的焊剂进行 性能测试。以自制的锡银铜系焊粉为基础制备焊膏并做焊接模拟。结果表明:采用有机酸和有机 胺复配制备的活性物质满足预期要求;复配溶剂满足沸点、黏度和极性基团三大原则;所制备的免 清洗焊剂多项性能满足规范要求,达到了免清洗的要求,解决了助焊性与腐蚀性的矛盾;所制备的 焊膏焊接性能良好,无腐蚀, 固体残留量低,存储寿命较长。 :助焊剂;焊锡膏;免清洗;活性剂 :TN6　　　:A　　　:1001 - 3474 (2006 )0 1 - 000 8 - 06 Preparation and Study ofNo- clean Flux Used forMaking Solder Paste WANG W ei- ke, HAO M ai- qun, WU Tao (X i′an University of technology, X i′an　71004 8, China) Abstract:A cco rding to the prope rty of the com position s in N o - clean so ldering flux, se lec t activa to ,r solven,t film form e r and accessories individu ally H om ogen izing each group a t certain tem pe ra ture to m ake flux and test the prope rties of the flux according to the standa rd T ake the pow de r o f tin, silver and copp er solde r as the b asis to m ake so lde r p aste and simu late so ldering The resu lt show s th at the activator w hich w as m ade up o f o rganic ac id and organic am ine com p lex satisfied the pro spective dem and The com pound solvent m e t the three dem ands o f bo iling po in,t v iscosity and po larity group The diversified properties o f the no - clean solde ring flux m et the standard requ irem en ts, actu alized the dem and of no - clean and solved the prob lem be wt een so lde rability and cau stic ity The prop erties o f the so lde r paste is fine, no co-r rosion, low so lid and it can be sto red fo r a long tmi e key words:F lux;So lder p aste;N o - c lean;A