LED学习资料(国外英文资料).docVIP

LED学习资料(国外英文资料) In this paper, by jonson0755 contribution Doc documents may have a poor browsing experience at the WAP end. It is recommended that you choose TXT, or download the source file to the native view. Large power white light LED packaging technology Reprinted from the LED silica gel - chan R Reprinted at 13:26, 2010. (3) review (0) : personal diary To report One, foreword high-power LED packaging due to the complexity of structure and process, and directly affects the use performance and life of the LED, has been the research hotspot in recent years, especially in high power white LED encapsulation is the hot point in research hot spot. LED packaging features include: 1. Mechanical protection to improve reliability; Strengthen heat dissipation to reduce the temperature of the chip and improve the LED performance. Optical control, increase the efficiency of light and optimize beam distribution; Power management, including ac/dc conversion, and power control. The selection of LED packaging methods, materials, structures and processes is determined by the chip structure, photoelectric/mechanical properties, specific applications and costs. After 40 years of development, LED encapsulation successively experienced the scaffolding (LampLED), patch type (SMDLED), power type LED (PowerLED) stage of development. With the increase of chip power, especially the needs of the development of the solid state lighting technologies for LED encapsulation, optical, thermal, electrical and mechanical structure put forward new and higher requirements. In order to effectively reduce the encapsulation heat resistance and improve the efficiency of the light, a new technological approach must be adopted to carry out the packaging design. The large power leds encapsulate key technologies in light, heat, electricity, structure and process, as shown in figure 1. These factors are mutually exclusive and interact with each other. It is the purpose of the LED packaging, the heat is the