生物识别 BGA 流程介绍.pptx

製作 : Alvin Yeh 指紋辨識封裝BGA介绍 一、產品介紹 二、BGA 流程介紹 序号 工序 子工序 设备名称 1 IQC 外觀檢驗 　 TEST ( O/S test) 　 2 Marking Laser Marking KAT-L-1 3 Baking Oven Cure KAT-O-1 4 Die Bond Die attach Datacon 2200EVO 5 Plasma Plasma clean KAT CNT-PC05 6 Molding Expose Mold Fico Expose Mold machine 7 翻片堆疊 翻片堆疊 KAT-F-1 8 Post More Cure Curing KAT-O-1 9 翻片堆疊 翻片堆疊 KAT-F-2 10 Package Saw Jig Saw( Half cut ) Fico FSL( Fico Sawing Line ) 11 Laser cut Laser cut ( R ) EO Laser machine 12 W-Color Coating Color Coating KAT-C-1 B-Color Coating Color Coating KAT-C-2 13 Coating Curing Curing KAT-O-1 14 Hard Coating+UV Cure Hard coating KAT-U-1 13 Package Saw Jig Saw ( Full Cut ) Fico FSL( Fico Sawing Line ) 14 Laser cut Laser cut ( R ) EO Laser machine 14 Flex Bonding SMT SMT LINE 15 Folding Folding Switch KAT-F-1 16 Final Testing Function Test Computer - 4 - Mold Compound Substrate Synaptics BGA - 5 - Blade Laser 三、各站流程介紹 - 7 - 三、各站流程介紹 8 Plan (4/29-5/9): 1. Substrate out line drawing ( vendor provide ) 2. Tooling status ( Check with vendor ) 3. Sample make ( KAT ASE ) 4. Check coating material and quality ( KAT ) 5. Equipment spec ( KAT BESI ) 6. Sample study ( ASE Besi KAT ) Request ( help ) : 1. Design substrate -- CH 2. Contact with substrate vendor --CH 3. Testing Tooling make -- Tom - 9 - The End!