一种制备W-Cu复合材料的新工艺.pdfVIP

第12卷第6期 粉末冶金材料科学与工程 2007年12月 Vb1．12 No．6 Materials Science and Engineering of Powder Metallurgy Dec 2007 一 种制备W-Cu复合材料的新工艺 苏维丰，熊 宁，周武平，吕大铭，吴 诚 (中国钢研科技集团公司 安泰科技股份有限公司，北京 100081) 摘 要：随着微电子信息技术的发展，W-Cu复合材料被用作基片、连接件和散热元件等热沉材料，因而具有更 广泛的用途。采用喷雾干燥．氢还原法制备了W-1OCu、W-15Cu和W-20Cu(Cu的质量分数依次为10％、15％和20％1 超细钨铜复合粉，并经过成形和烧结制得w．15Cu合金，测量了烧结后的合金导热性能。结果表明，在一定的还 原条件下，可以获得粒度细小、氧含量低、钨铜复合均匀的W-Cu复合粉末；W-15Cu合金的相对密度可以达到 99．34％，结构组织高度均匀、一致，热导率为184．0 W／m·K，已达到其做为热沉材料的热性能要求。 关键词：钨铜复合粉；成分均匀性；烧结；热导率 中图分类号：TG 146 文献标识码：A 文章编号：1673．0224(2007)6．369．05 A kind ofnew technology for preparing tungsten-copper composite material SU Wei-feng，XIONG Ning，ZHOU Wu—ping，LO Da—ming，WU Cheng (China IronSteel Research Institute Group， Refractory Material and Ceramics Branch ATM Co．，Ltd，Beijing 100081，China) Abstract：W．1OCu，W．15Cu and W-20Cu ultrafine powders with Cu mass fraction of 10％，15％ and 20％ respectively were prepared by spray drying—hydrogen reduction process，a sintering test was carried out on the W-15Cu composite powders and the thermal conductivity of the sintered alloy was measured．The results show that the composite powder with fine grain，low oxgen content and uniform in compositing of tungsten copper could be obtained under a certain reduction condition，the relative density of sintered W-1 5Cu alloy prepared by using W-1 5Cu composite powders is 99．34％，the microstructure is highly uniform and consistent，the thermal conductivity is 1 84．0 W／m·K reaching the therm al functional requirement of thermodeposition materia1． Key words：tungsten—copper composite powders；uniformity of composition；sintering；thermal conductivity W．Cu