Sn_Bi系无铅焊料熔体结构转变及其对凝固组织及润湿性的影响.pdfVIP

17 6 Vol17, No6 2 0 1 0 1 2 M etallic Functional Materials December, 2010 Sn-Bi 1, 2 3 1 1 李小蕴 , 吴 炜, 陈红圣 , 祖方遒 ( 1 , 230009; 2 , 230009; 3 , 230009) : Sn 57% Bi , Sn 57% Bi : Sn 57% Bi 785~ 900 , , ; , :; Sn Bi ; ; :TG4251 : A : 1005 8192(2010) 06 0036 04 StructureTransitionof Lead-freeSn-Bi Solders andItsEffectson SolidificationandWettability 1, 2 3 1 1 LI Xiao yun , WU Wei , CH EN H ong sheng , ZU Fang qiu ( 1 School of Material Science and Engineering, H efei University of Technology, H efei 230009, Anhui, China; 2 School of Mechanical and Automotive Engineering, Hefei University of Technology, H efei 230009, Anhui, China; 3 Industrial T raining Center, Hefei U niversity of T echnology, Hefei 230009, Anhui, China) Abstract: In this paper, the electrical resistivities of liquid Sn 57% Bi lead free solder w ere measured Based on the measured results of elect rical resistivity, corresponding solidification and w ettability experiments have been carried outThe result s show melts structure transition was found out at 785~ 900 above the liquid line for lead free Sn 57% Bi solder M elts structure transition can refine primary phases and eutectic phases, and change micro pattern The wettabilities of the solder after structure transition is better than that of the solder before structure transition Keywords: lead f ree solder; Sn Bi alloy; melt structure transition; electrical resistivity ( Sn Pb) ( )