超精密表面抛光材料去除机理研究进展-中国科学.PDFVIP

49 17 2004 9 (, 100084. E-mail: jinxu618@163.com ) (Chemical-Mechanical Polishing, CMP), . (Ultra-large Scale Integration, ULSI)/ , , . CMP ULSI , . , , . , 1 (IC)CMP , 2 1.1 . 77.5~155 Gb/cm , W 0.1 nm, CMP a Ra0.05 nm. , , , . , [8] [1], 2011 0.05 . 1990 , Cook µm, 450 mm. Si , SiCMP , , SiSiO2 . , . TEMSi(100) [2]. , / (CMP) , , [9]. [3~5] [6,7] [10], 2 / . µmSi(100), , . 0.3 µm , {111} , , , CMP . 1). , 50 nm , HRTEM( 1),