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平板导体中裂纹缺陷探伤涡流场的求解
20 7 Vol. 20 No. 7
2000 7 Pro ceedings of the CSEE Jul. 2000
: 025880 13 ( 2000
1 1 2
陈德智 , 邵可然 , 盛剑霓
( 1. 华中理工大学电力工程系, 湖北省武汉市430074; 2. 西安交通大学, 陕西省西安市710049
SOLUTION OF EDDY CURRENT PROBLEM DUE
TO THIN CRACKS IN A PLATE CONDUCTOR
1 1 2
CHEN Dezhi , SHA O Keran , SHEN G Jianni
( 1. Huazhong U niversit y of Science and T echnolog y, Wuhan 430074, China;
2. Xian Jiaot ong University , Xian 7 10049, China
ABSTRACT: A thinopening crack in a plate conducto r is much , J. R . Bow ler
fr equently encountered in eddy current nondestructive testing . [ 1]
, ,
Considering that the crack thickness is usually very small, it can
,
be taken as asur face def ect w ith zerothickness. T he eddy
cur rent f ield perturbation due to the crack is described as the ef ,
f ect produced by an equivalent curr ent dipole layer located on its
surf ace and the dipole density is found by solving a boundary in ,
tegral equation . By follow ing a mo ment met hod scheme the
,
probe impedance changes due to the crack are ev aluated. Be
cau se the 3D problem has been reduced to a 2D one, the re ,
quired computer memo ry and CPU time are greatly r educed . ,
T he numer ical pr edictions are compar ed w ith ex periments and (
g ood agreement is found .
KEY WORDS: eddy current testing ; thin crack ; plate conduc 1
tor; forw ard problem ; numer ical analysis
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