SnCu钎料镀层与Cu_Ni镀层钎焊接头的界面反应.pdfVIP

17 3 2007 3 Vol.17 No.3 The Chinese Journal of Nonferrous Metals Mar. 2007 1004-0609(2007)03-0410-07 SnCu Cu/Ni ( 150001) IMC IMC SnCu Cu Cu Sn Cu Sn 6 5 3 SnCu Cu/Ni TG 111 A Interfacial reactions between Sn-Cu solder alloy and Cu/Ni coatings during reflow soldering DIAO Hui, WANG Chun-qing, ZHAO Zhen-qing, TIAN Yan-hong, KONG Ling-chao (Microjoining Laboratory, School of Materials Science and Engineering, Harbin Institute of Technology, Harbin 150001, China) Abstract: The interface microstructures of soldered joints under different soldering techniques were observed and analyzed. The interface reaction during soldering was studied. The growth mechanism of the IMCs was discussed and the influences of soldering temperature and dwell time on IMC evolution were investigated. The equation of the relationship between IMCs thickness and soldering conditions including soldering temperature and dwell time was developed. The results suggest thatduring soldering, the joint interface between the solder and Cu/Ni coating exhibits a duplex structure of Cu Sn and Cu Sn intermetallic compounds (IMCs). A parabolic relationship exists between the growth of the IMC 6 5 3 layer and soldering time. This indicates that the mechanism of IMC growth is a diffusion-controlled process. The growth rates for the intermetallic layers increase with soldering temperature, whereas decreases with time. Key words: SnCu solder alloy coating; Cu/Ni coating; intermetallic compound; soldering; int