激光表面处理对陶瓷基底化学镀铜层结合力的影响-中国表面工程.PDF

19 4 Vol.19 No.4 28 2006 2006 8 CHINA SURFACE ENGINEERING August 2006 , 350002 : 14 µm 2 16.5 N/mm : TN249; TQ153.1 A 1007–9289(2006)04–0028–04 The effect of Laser Treatment on the Bonding Strength Between Ceramic Substrate and Cu Electroless Plating layer SHEN Yi-cheng, XU Zhen-lin, ZHAO Xiong-chao, GU Zhi-jun (Fujian Institute of Rearsch on the Structure of Matter, Fuzhou China, 350002) Abstract The Ceramic surfaces with different roughness were obtained after laser treatment with different scan space, then a Cu coating was deposited on the substrate by electroless plating technology. In this paper, the effect of roughness of ceramic surface on the bonding strength between ceramic substrate and Cu electroless plating layer was discussed. The scan space of laser showed a great effect on the roughness of ceramic surface. When the scan space of laser was 14 µm, it was possible to get the ceramic surface with higher roughness It was also noticed that the bonding strength between ceramic substrate and Cu layer was increasing when the roughness of ceramic surface was enhanced accordingly. In this research, a Cu electroless plating layer with bonding strength 16.5 N/mm2 was obtained, it exceeded the demand of common industrial application greatly. Key words: laser process; electroless plating Cu; roughness; binding strength 0