考虑参数随机性的焊点热疲劳失效分析.pdfVIP

装 备 环 境 工 程 第 14 卷 第4 期 ·96 · EQUIPMENT ENVIRONMENTAL ENGINEERING 2017 年4 月 装备通用质量特性及寿命评估 考虑参数随机性的焊点热疲劳失效分析 申海东，李志强，吴俊毅 （北京航空航天大学 可靠性与系统工程学院，北京 100191） 摘要： 目的研究电子产品焊点几何参数的随机性对焊点热疲劳寿命的影响。方法 基于Coffin-Masson 的修 正式 Engelmaier 模型，建立考虑多参数随机性的引线型封装的焊点热疲劳寿命评估模型，并利用蒙特卡罗 法对该模型的精确度进行验证。以SMT 鸥翼型（gull-wing ）TSOP062 封装为例，将焊点几何参数的随机性 对热疲劳寿命的影响进行量化分析。结果 影响焊点寿命的几何参数离散系数越大，焊点疲劳寿命越小，随 机变量越多，焊点热疲劳寿命下降的越明显，焊点高度是影响元器件热疲劳寿命的敏感参数。结论 该方法 在已知小批次产品的参数波动信息的情况下，能预测整批次产品的热疲劳寿命，极大地减少试验时间和成 本，提高电子产品及装备的可靠性。 关键词：焊点；热疲劳；概率评估；蒙特卡罗 DOI ：10.7643/ issn.1672-9242.2017.04.020 中图分类号：TJ01 ；TG405 文献标识码 ：A 文章编号 ：1672-9242(2017)04-0096-05 Thermal Fatigue Failure of Solder Joints Considering Randomness of Parameters SHEN Hai-dong, LI Zhi-qiang, WU Jun-yi (School of Reliability and System Engineering, Beihang University, Beijing 100191, China) ABSTRACT: Objective To research influences of geometric parameters on the thermal fatigue life of solder joints. Methods Based on the Engelmaier model, the variant form of Coffin-Masson’s and lead package of multiparameter randomness, a solder fatigue life probability evaluation model was established. Monte Carlo method was adopted to verify the accuracy of the model. SMT (Surface Mount Technology) gull-wing TSOP062 package was taken as an example. Quantitative analysis on influences of geometrical parameters of solder joints on thermal fatigue life was carried out. Results The fatigue life of solder joint decreased with the increase of geometric parameters discrete coefficient. The more random variable of geometric parameters, the lower re- liability of solder joints. The height of welder joint was a sensitive