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立沈年行度度理冷冷冷利念利冷量省省力降理行冷流流量度流度量度不量行立例量度量度度冷度量度不流不度量不度不不量不度量
立
論
盧
狀
沈
年
狀行
度
度理CPU冷冷冷利
來來
念利LCD
冷CPU量
省省力降
理論
行
0.12m2 CPU
冷參數流類 流量
度 流 度 量
度不 70
量24w 狀
行
Abstract
The purpose of this investigation was to fabricate a new
plate-shape heat pipe and to test the thermal performance of this heat
pipe.
Heat pipe is a device that makes use of the property of phase
change between liquid and vapor to transport mass thermal energy.
Because of the boiling and condensation during the change phase, it may
obtain relatively larger heat-transfer coefficient than that in the liquid or
vapor force convection. Therefore, heat pipes are commonly found in the
applications such as heat dissipation, heat spreading, energy storage, heat
recovery and improvement of the cooling speed of cooked foods …etc.
Due to the fact that semiconductor industry has been developed
unceasingly in recent years, the heat dissipating effectiveness for the
miniaturized and integrated high power electronic devices have become
more and more important. Correspondingly, CPU dissipation methods
have successively made progress from natural convection, forced
convection, to heat pipe .In the foreseeable future, the size of heat-sink
will decide the size of the electronic products. Base on this concept, this
study attempted to design a new heat dissipation device in which the back
plate of the LCD monitor of a notebook computer was utilized as a
natural cooling dissipater. The undesirable heat from CPU was
transported by hea
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