ROHS豁免清单一览表.docxVIP

RoHS 豁免清单豁免项对应文件号签署/颁布日期1. Mercury in compact fluorescent lamps not exceeding 5 mg / lamp小型日光灯中的汞含量不得超过5毫克/灯2002/95/EC2003.01.27/2003.02.132a. Mercury in straight fluorescent lamps for general purposes not exceeding halophosphate 10 mg一般用途的直管日光灯中的汞含量不得超过磷酸盐10 毫克2b. Mercury in straight fluorescent lamps for general purposes not exceeding triphosphate 5 mg.一般用途的直管日光灯中的汞含量不得超过正常的三磷酸盐 5毫克2c. Mercury in straight fluorescent lamps for general purposes not exceeding triphosphate 8 mg一般用途的直管日光灯中的汞含量不得超过长效的三磷酸盐 8毫克3. Mercury in straight fluorescent lamps for special purposes.特殊用途的直管日光灯中的汞含量4. Mercury in other lamps not specifically mentioned in this list本附录中未特别提及的其它照明灯中的汞含量5. Lead in glass of cathode ray tubes, electronic components and fluorescent tubes阴极射线管、电子部件和荧光管的玻璃内的铅含量6a. Lead as an alloying element in steel containing up to 0.35% lead by weight.铅作为钢的合金元素，其含量可达0.35%（重量计）6b. Lead as an alloying element in aluminum containing up to 0.4% lead by weight.铅作为铝的合金元素，其含量可达0.4%（重量计）6c. Lead as an alloying element in copper containing up to 4% lead by weight铅作为铜的合金元素，其元素含量可达4%（重量计）7a. Lead in high melting temperature type solders. (i.e. lead based solder alloys containing 85% by weight or more lead)较高熔融温度型焊料中的铅（即：铅含量达85%或以上的铅基焊料合金）2005/747/EC2005.10.21/2005.10.257b. Lead in solders for servers, storage and storage array systems, network infrastructure equipment for switching, signaling, transmission as well as network management for telecommunications.用于服务器、存储和存储列阵系统、以及电信用交换、发信、传输和网络管理的网络基础设施设备的焊料中的铅7c. Lead in electronic ceramic parts (e.g. piezoelectronic devices.)电子陶瓷产品中的铅（例如：高压电子装置）8. Cadmium and its compounds in electrical contacts and cadmium plating except for applications banned under Directive 91/338/EEC amending Directive 76/769/EEC relating to restrictions on the marketing and use of certain dangerous substances and preparations 除了76/769/EEC《关于限制某些有害物质和制品销售和使用》指令的修改件91/338/EEC 指令中禁止用途外，电触头和镉镀层上的镉及其化合物9. Hexavalent chromium as an anti-corrosion of the carbon steel coo