有害物质披露表标准集成电路HazardousSubstance.PDFVIP

有害物质披露表 ：标准集成电路 Hazardous Substance Disclosure Table for: STANDARD INTEGRATED CIRCUITS Rev. 2 May 2017 以下信息已提供符合电子信息产品的对电子信息产品污染控制管理办法规定中国的污染控制 SJ/T t11364-2014 标记。 The following information has been made available to comply with SJ/T11364-2014 Marking for Control of Pollution Caused by Electronic Information Products as required by Chinas Management Methods for the Control of Pollution from Electronic Information Products. 以下有害物质披露表适用于Xilinx集成电路包含在SJ / t11364-2014在均质材料的限制要求，是否含有过量的铅。适用于以 下产品： 包装码BF、BG、CL、CP、CS、FB、FF、FG、FS、FT、HQ、PC、PD PQ，SF，因此，TQ，VO ，VQ ， BFG，FFG，FBG，FHG，FLG，FSG，SBG ，SFG，RFG。一个例子，在哪里找到包代码显示在下面的图片 The following hazardous substance disclosure table applies to Xilinx integrated circuits which contain lead in excess of the homogenous material limit requirements in SJ/T11364-2014. This applies to products with the following package codes : BF, BG, CL, CP, CS, FB, FF, FG, FS, FT, HQ, PC, PD PQ, SF, SO, TQ, VO, VQ, BFG, FFG, FBG, FHG, FLG, FSG, SBG, SFG, RFG. An example of where to find the package code is shown in the image below. 赛灵思标准集成电路 封装代码示例 Example of a Xilinx standard integrated circuit package code 危险物质名称和浓度表 Table of hazardous substances name and concentration 组件名称 Component name 铅 汞 镉 六价铬 多溴化联苯 多溴联苯醚 (Pb) (Hg) (Cd) (Cr6+) (PBB) (PBDE) BGA X O O O O O BGA Flip Chip (BGA倒裝芯片) O: 表明此有毒或有害物质包含在本部分的所有均质材料中，根据 EIP-A, EIP-B