填充泡沫复合相变材料的热控单元热性能研究 吴斌.pdfVIP

DOI :10.13224/j.cnki .jasp.2010.11.014 25 11 Vol.25 No .11 2010 11 Journal of Aerospace Power Nov .2010 :1000-8055(2010)11-2486-07 吴　斌, 邢玉明 ( , 100191) 　　　:(T CU), . , (FCPCM) TC U (PCM), , ., PCM , , T CU , FCPCM , PCM .T CU . 　　:;;;; + :TK512 .4　　　　　:A Numerical investigation of thermal control unit with foam composite phase change material W U Bin, XING Y -ming (School of Aerona tics Science and Technology, Beijing University of Aerona tics and Astrona tics, Beijing 100191, China) Abstract:Tw o-dimensional mathematical model of portable electronic devices thermal control nit (TCU)w as presented, and n merical comp tation w as cond cted to analyze its thermal performance.The res lts show that, TCU design by filling w ith foam composite phase change material (FCPCM )and adding fins can w ell improve the heat cond ction of phase change material (PCM )in the TCU and also satisfy the need of electronics w orking condition;and the former design is s perior to the latter one.F rthermore, n merical in- vestigations w ere made to st dy the selection of foam matrix material and PCM .It is concl - ded that porosity is a key parameter of TCU design, and al min m FCPCM has good ther- mal performance and the selection of PCM sho ld depend on the operating condition of elec- tronics.The concl sion provides g idelines for portable electronic devices TCU design and optimization. Key words: portable electronic devices;thermal control nit;thermal performance; n merical comp tation;foam composite phase change material 　　, , 55 %