手机中的3D封装堆叠技术.pdfVIP

Invited Speaker 2008 2008 Catching the Mobile Wave: Packaging is Going 3D 2008 Burn-in and Test Socket Workshop March 9 - 12, 2008 Belgacem Haba, Ph.D. Tessera Outline • Introduction • Driving forces and limitations • 3-D package stacking • 3-D wafer-level stacking • 3-D by embedding technologies • 3-D in optics • Conclusion 03/09/2008 Catching the Mobile Wave: Packaging is Going 3D 2 March 9 - 12, 2008 1 Invited Speaker 2008 2008 Packaging is the key • About 1cm cube of silicon • The rest is Packaging 03/09/2008 Catching the Mobile Wave: Packaging is Going 3D 3 Mobile Phone Evolution 1970s 1980s 1990s Today ~$5000 ~$4000 ~$300 Free Voice, Voice Voice Voice Data 03/09/2008 Catching the Mobile Wave: Packaging is Going 3D 4 March 9 - 12, 2008 2 Invited Speaker 2008 2008 Evolution of Memory Jan 7th PR: SanDisk Announces the 12- Gigabyte microSDHC Card – • 5MB IBM hard drive, 1956 the Worlds Largest Capacity Card for Mobile Phones 03/09/2008 Catching the Mobile Wave: Packaging is Going 3D 5 Outline • Introduction • Driving forces and limitations • 3-D package stacking • 3-D wafer-level stacking • 3-D by embedding technologies • 3-D in optics