A Thesis on Design Optimization of Heat Sink in （一篇论文的散热器优化设计）.pdf

P.Chennakesavarao Int. Journal of Engineering Research and Applications ISSN : 2248-9622, Vol. 4, Issue 10( Part - 5), October 2014, pp.83-94 RESEARCH ARTICLE OPEN ACCESS A Thesis on Design Optimization of Heat Sink in Power Electronics 1 2 P.Chennakesavarao P.Srihari M.E (Thermal Engg.) student, Aditya Institute of Technology and Management, Tekkali. Afessor, Aditya Institute of Technology and Management, Tekkali. ABSTRACT The heat sinks are used in electronic systems to remove heat from the chip and effectively transfer it to the ambient. The heat sink geometry is designed by the mechanical engineers with the primary aim of reducing the thermal resistance of the heat sink for better cooling in the electronic systems. Due to the proximity of the heat sink with the ICs, the RF fields created by RF currents in the ICs/PCBs gets coupled to heat sinks. Hence, the coupled RF current can cause radiated emission. This radiated noise from the device can couple and disturb the functioning of the nearby electronic systems. Also this radiated emission from the device poses a problem to the system compliance with respect to EMI/EMC regulations. The international EMI/EMC standards require the radiated emission from the electronic devices to be kept below the specified limits. As a result the design of Heat Sink is very important factor for the efficient operation of the electronic equipment. In this project design optimization of a Heat sink in a Power amplifier is performed to reduce the weight and size .Power amplifier is electronic equipment mounted in an army vehicle. The power modules inside the amplifier generates a heat of 1440 Watts and a temperature of 140 0c.Two Heat sinks