AND9016 - Heat Sink Selection Guide for （AND9016散热器选择指南）.PDFVIP

AND9016/D Heat Sink Selection Guide for Thermally Enhanced SO8-FL Introduction Thermal management has become a critical element in today’s electronic design, as more compact designs have led APPLICATION NOTE to greater difficulty in removing heat from the system. In order to keep the components within their safe operating area, the operating temperature of the components must not Figure 1 illustrates a basic thermal resistance diagram for exceed the manufacturer specified maximum temperature. a device with a heat sink. For the purpose of this analysis, A reduction in operating temperature increases the heat dissipation through the bottom of the package will not component life expectancy and therefore increases the be addressed. reliability of the system. The use of heat sinks provides an affordable method to increase the performance of power MOSFETs with minimal impact to the design layout. ON Semiconductor has introduced a Thermally Enhanced (TE) SO8−FL MOSFET portfolio in order to aid in this endeavor. The SO8−FL TE utilizes a different mold compound that has over 3.5 times the thermal conductivity of the standard SO8−FL mold compound. As shown in the Guide to Thermally Enhanced SO8−FL (ON Semiconductor application note AND9014/D) the SO8FL−TE has the greatest advantage compared to a standard SO8−FL when it is used with a heat Figure 1. Thermal Resistance Diagram for Device sink on the top of the device. with Heat Sink Heat Sink Basics The overall thermal resistance RJA through the top of the In power converter