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Application of thermal grease - IGBT(应用热油- IGBT)
Application Note
Datum: 19-12-2005 Seite 1
AN-Nummer: AN-2006-02 Abteilung: AIM PMD ID AE
Application of screen print templates
to paste thermal grease within IGBT
modules
Introduction
When operating semiconductor modules the power losses need to be
transferred to a heatsink in order not to exceed the maximum junction
temperature of the components.
Thermal compound is normally used to aid thermal contact between
module and heat sink. Both unevenness of the base plate and surface
roughness of the heat sink are thus compensated.
The following introduces the screen print process to apply thermal
compounds.
Screen print template
Contrary to conventional methods of paste application this procedure
applies the thermal compound only to areas where it is required.
To begin with, a surface scan of the base plate was used to determine
the quantity of thermal compound required.
Figure 1 shows the base plate surface structure of a mounted
EconoDUAL™ module (FF450R12ME3).
TM
Fig.1: Surface of a mounted EconoDUAL baseplate.
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