Advances in Light Curing Adhesives Dymax （光固化胶粘剂的进步Dymax）.pdf

Advances in Light Curing Adhesives Andrew G. Bachmann* Dymax Corporation, Connecticut ABSTRACT This paper describes the development of a new family of light curing adhesives containing a new reactive additive previously not used in optical grade light curing adhesives. High performance properties, such as high T , previously not associated g with light curing adhesives are obtained with the addition of functionalized cellulositics. Outgassing as low as 10-6 grams/gram has been observed based on headspace sampling. Other additives have lowered the shrinkage rates of positioning (edge bonding) adhesives from near 1% to less than 0.1% with fractional percentage movements over thermal range of -40ºC to + 200ºC. Key words : Adhesive, UV Cure, Ultraviolet Light, Visible Light Cure, Acrylic, Epoxy, UV Epoxy, Bond, Cure, Cement, USP Class VI. 1. INTRODUCTION UV curing adhesives have typically been considered lower performing than epoxies and other “classical” adhesive technologies. The reputation has been partially deserved because properties inherent in “first generation UVs” led to shrinkage on cure, stress and mismatch that have been difficult to control. High powered and overly complicated specialty UV curing systems have evolved in an attempt to “improve performance”. (1) The result can be unnecessary expense with little to no increase in effectiveness. Figure 1 below illustrates the process efficiency and